QY-MB-1235U-DH-3.5 inch
A highly integrated small-size motherboard designed with a 3.5-inch (146*105mm) specification.
PRODUCTS FEATURES
CPU:
i3-1215U
RAM:
1*DDR IIII RAM Slot
Storage:
1 * non-ECC SO-DIMM Slot, up to 32GB
Interfaces:
2*LAN, 9*USB, 6*COM, 1 * HDMI
Expansion Slot:
1 * M.2 Key-E Slot +1 * M.2 Key-B Slot
Introduce
Features
Specification
Marking Instruction
Introduce:
QY-MB-1235U-3.5 inch
1. i3-1215U
2. 2*RJ-45,9*USB
2 * RS232+3 * RS232/TTL+1 * RS232/RS485/TTL
3. 1 * HDMI display ports
4. LPDDR4/4X, Optional 2GB+LPDDR4/4X, Optional 4GB+LPDDR4/4X, Optional 8GB
5. 1 * M.2 Key-M Slot+1 * SATA3.0 7P Connector
6.Windows 10 IoT Enterprise 2021 LTSC / Linux Kernel 5.17 or later
2. 2*RJ-45,9*USB
2 * RS232+3 * RS232/TTL+1 * RS232/RS485/TTL
3. 1 * HDMI display ports
4. LPDDR4/4X, Optional 2GB+LPDDR4/4X, Optional 4GB+LPDDR4/4X, Optional 8GB
5. 1 * M.2 Key-M Slot+1 * SATA3.0 7P Connector
6.Windows 10 IoT Enterprise 2021 LTSC / Linux Kernel 5.17 or later
Features:
CPU
i3-1215U
RAM
Intel® UHD Graphics,Up to 64 EUs, 1.10 GHz
Intel® Iris® Xe Graphics,Up to 80 Eus, 1.20 GHz/Up to 80 Eus, 1.30 GHz
System
Windows / Linux
Rich I/O interfaces
2*RJ-45,9*USB
2 * RS232+3 * RS232/TTL+1 * RS232/RS485/TTL
Display Ports
1 * HDMI+1 * DP
Various optional modules
WIFI / 4G module
Temperature
Storage: -20~75℃
Operating: 0~60℃
Power input
DC 12V/24VAuto Detect
Specification:
| Model | QY-MB-1215U-3.5 | |||
CPU |
CPU Model |
Intel® CoreTM Alder Lake-P Processor | ||
| i3-1215U | i5-1235U | i5-1240P | ||
| Clock Speed | 1.20GHz | 1.30GHz | 1.70GHz | |
| Multi-Core | 2P4E | 2P8E | 4P4E | |
| TDP | 15W | 15W | 28W | |
| Graphics | Intel® UHD Graphics | Intel® Iris® Xe Graphics | ||
| Up to 64 EUs, 1.10 GHz | Up to 80 Eus, 1.20 GHz | Up to 80 Eus, 1.30 GHz | ||
Display |
1 * HDMI (TYPE-A): max resolution up to 2048*1080@60Hz 1 * DP++ (TYPE-A): max resolution up to 4096*2304@60Hz 1 * LVDS/eDP (Wafer): LVDS max resolution up to 1920*1200@60Hz (Default) or eDP max resolution up to 3840*2160@60Hz |
|||
| Memory | Support DDR4-3200 MHz, 1 * non-ECC SO-DIMM Slot, up to 32GB | |||
| Storage | 1 * SATA3.0 7P Connector (With 1 * SATA Power Wafer) 1 * M.2 Key-M Slot (PCIe x4/ SATA, Default PCIE 4x, Support PCIe x4 NVMe, 2280) |
|||
| Ethernet | 2 * Intel® GbE LAN Chip (10/100/1000 Mbps, RJ45) | |||
Audio |
Realtek Audio HAD Codec, 1 * Line-Out + MIC 2in1 3.5mm Jack 1 * Amplifier Wafer, 3-W (per channel) into a 4-Ω Loads |
|||
| Expansion Slots | 1 * M.2 Key-E Slot (PCIE+USB2.0, Default PCIE, Support WIFI, 2230) [1] 1 * M.2 Key-B Slot (PCIE + USB3.0 + USB2.0, Support 5G/4G, 2242/3052) [2] 1 * SIM Card Wafer |
|||
| COM [3] | 2 * RS232 (COM1/2, Wafer, Full lanes) 3 * RS232/TTL (COM3/4/5, Wafer, 3 lanes) 1 * RS232/RS485/TTL (COM6, Wafer, 3 lanes) |
|||
| USB | 6 * USB3.0 (TYPE-A, Rear IO) 3 * USB2.0 (Wafer, Internal)[1][2] |
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Other Ports |
1 * 8-bit GPIO Wafer 1 * Front Panel Wafer 1 * I2C Touch Wafer 1 * System FAN Wafer 1 * CPU FAN Wafer 1 * CMOS Clear Jumper |
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| System | Windows 10 IoT Enterprise 2021 LTSC, Windows 10 (21H2), Windows 11 (21H2) or later, Linux Kernel 5.17 or later |
|||
| Temperature | Storage: -20~75℃ Operating: 0~60℃ |
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| BIOS | AMI UEFI BIOS (Support Watchdog Timer) | |||
| Power Supply | DC12V/24VAuto Detect (DC 24V or 12V Optional) 1 * DC 12V/24V Power Input Φ2.5mm Thread Jack (2P 3.5mm/5.08mm Terminal Block Optional) |
|||
| Factor | 3.5-inch Standard (146mm * 105mm) | |||
Notes:
[1]: One of USB2.0 signal for M.2_KEYB_SSD/WWAN1 colay with F_USB2. They can’t be used at the same time. (resistor selectable)
[2]: One of USB2.0 signal for M.2_KEYE_WLAN1 colay with F_USB2. They can’t be used at the same time. (resistor selectable)
[3]: TTL signal of COM3/4/5/6 come from the same IC. They must be RS232 or TTL at the same time.
Marking Instruction:
Connector&Header
| Jumpers / Headers and Connectors | ||
| 1 | U1 | CPU |
| 2 | DIMM1 | DDR4 SO-DIMM Slot |
| 3 | DC_IN1 (DC_IN) (DC_IN) | DC Power Input Φ2.5mm Thread Jack (DC Power Input 2P 3.5mm Terminal Block) (DC Power Input 2P 5.08mm Terminal Block) |
| 4 | HDMI1 | HDMI Upright TYPE-A Connector |
| 5 | DP++1 | DP++ Upright Connector |
| 6 | LVDS1 | eDP/LVDS Signal Wafer |
| 7 | LVDS_P1 | eDP/LVDS Backlight Control Wafer |
| 8 | JC_LVDS1 | eDP/LVDS VDD Select Jumper |
| 9 | PJ1 | Line-Out + MIC 2in1 3.5mm Jack |
| 10 | J_SPK1 | Amplifier Wafer |
| 11 | SATA1 | SATA3.0 7P Connector |
| 12 | P_SATA1 | SATA Power Wafer |
| 13 | M.2_KEYM_PCIESSD1 | M.2 Key-M Slot (PCIe x4/SATA, Support PCIe x4 NVMe/ SATA SSD, 2280) |
| 14 | M.2_KEYE_WLAN1 | M.2 Key-E Slot (PCIE+USB2.0, Support WIFI+ BlueTooth, 2230) |
| 15 | M.2_KEYB_SSD/WWAN1 | M.2 Key-B Slot (PCIE + USB3.0 + USB2.0, Support5G/4G, 2242/3052) |
| 16 | J_SIM1 | SIM Card Wafer |
| 17 | LAN1 | GbE LAN RJ45 Connector |
| 18 | LAN2 | GbE LAN RJ45 Connector |
| 19 | R_USB1 | Dual USB3.0 TYPE-A Connector |
| 20 | R_USB2 | Dual USB3.0 TYPE-A Connector |
| 21 | R_USB3 | Dual USB3.0 TYPE-A Connector |
| 22 | F_USB1 | Front USB2.0 Wafer |
| 23 | F_USB2 | Front USB2.0 Wafer |
| 24 | J_COM1 | COM1 Wafer |
| 25 | J_COM2 | COM2 Wafer |
| 26 | J_COM3 | COM3 Wafer |
| 27 | J_COM4 | COM4 Wafer |
| 28 | J_COM5 | COM5 Wafer |
| 29 | J_COM6 | COM6 Wafer |
| 30 | J_COM6_1 | COM6 RS485 Wafer |
| 31 | J_GPIO1 | GPIO Wafer |
| 32 | F_PANEL1 | Front Panel Wafer |
| 33 | J_I2C1 | I2C Wafer |
| 34 | SYS_FAN1 | System FAN Wafer |
| 35 | CPU_FAN1 | CPU FAN Wafer |
| 36 | J_BAT1 | CMOS Battery Wafer |
| 37 | CLR_CMOS1 | CMOS Clear Jumper |
| 38 | J_ESPI1 | ESPI Debug Header |
| 39 | J_PRM1 | Power Debug Wafer |
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